CREST

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   We wish to acknowledge support from  
Hewlett Packard for instruction level parallel processing and embedded systems.
Panasonic for embedded systems and adaptive computing.
DARPA funds our DIS Project (contract number F33615-99-1-1499).
DARPA funds our PACC Project (contract number F30602-00-2-0564)
Yamacraw has provided a portion of seed funding and supports the growth plans for CREST.
   
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